CoolWall Technology

The Curtiss Wright Controls Defense Solutions' CoolWall™ for thermal management of rugged embedded computing enclosures has shown a greater than 2x improvement in payload power cooling when compared to traditional aluminum construction. In addition, this breakthrough technology, based on a proprietary mixture of metal composite materials, delivers its dramatically higher thermal conductivity at a weight significantly lighter than aluminum. The ability to thermally manage higher power payloads is critical in leading edge multiprocessing and DSP applications using new products such as VPX where space, weight, power and cost (SWaP-C)-constraints are key design hurdles. CoolWall technology can be used both to improve thermal performance and reduce weight. Defense Solutions plans to make this advanced cooling technology available to the embedded market in a broad line of Hybricon® engineered packaging solutions.