This white paper discusses C4ISR applications' demand for large capacity storage with reduced SWaP and methods to increase storage on Single Board Computers without use of external storage...
This white paper outlines the key challenges system integrators face when building a system with 3U VPX COTS-based solutions and explains methods to shorten development cycles.
The Low Powered, High-Integrity Future of Defense and Aerospace Embedded Computing
Erik Schechter with C4ISR & Networks Magazine discusses how the military has been putting a greater emphasis on resilient vehicle electronics.
John Keller with Military & Aerospace Electronics writes about Northrop Grumman's recent contract award to the U.S. Navy for airborne laser mine detection systems (ALMDS).
John Keller with Military & Aerospace Electronics discusses the blending of FPGAs, CPUs, GPGPUs and server-class processors for optimal performance in HPEC systems.
Authored by: Jacob Sealander
Authored by: Mike Southworth
Authored by: Tom Roberts
Tactical Unmanned Aircraft Systems (UASs) used for reconnaissance, surveillance, targeting, and assessment required an upgrade for Ethernet switching capabilities for onboard communications and...
Curtiss-Wright is a subcontractor to Northrop Grumman, providing an optimized, scalable, flexible and affordable Advanced Mission Management System (AMMS) solution for the MQ-4C Triton Unmanned...
Learn more about Curtiss-Wright's application-specific chassis designed to meet the system upgrade needs of a mission critical NATO naval surface program.
This edition of Defense Solutions Quarterly eNewsletter highlights the Bicycle Shop incubator, the pocket size DuraNET 20-11, CHAMP-FX4 video and Tin Whiskers white paper.
This issue highlights a new webinar on OpenVPX Gen3 Signal Integrity, LRU consolidations to reduce SWAP-C, and safety certifiable COTS solutions to expedite your system development
This issue of Defense Solutions Quarterly highlights system solutions tailoring to your program needs, UAV Embedded Technologies, and a Special Report on Pad Cratering in electronics.